Original Japan Goot Desoldering Wicks Braid Copper Wire Solder

Selamat Datang di Toko Kami. - Kami Menjual Produk-produk Import - Produk Dikirim dari Luar Negeri. - Estimasi Kiriman 5-15 Hari. Mohon Menunggu is_customized : No Model Number : MM-304 Certification : NONE Material : Pure copper Feature : TAIYO Goot Wick Desoldering Wick Type : BGA Desoldering Copper Wire Braid Diameter : 1.5/2.0/2.5/3.0/3.5mm/4.5mm Feature 1 : Welding Soldering Tools Accessories Feature 2 : Solder Remover Feature 3 : BGA Desoldering Copper Wire Wick Material : Alloy Copper Function : For Precision PCBs RMA Tin Remover Model Number : CP-15B 20B 25B 30B 35B Melting Point : 1083 Degrees Celsius Function1 : For Soldering Iron use Application : motherboard repair tool Length : 30M Features: FOR LEAD-FREE DESOLDERING Our thin and soft desoldering wires flat braid has efficient thermal transmission. Removes solder faster with better heat response than previous wicks. Recommended for lead-free solder with high heating load. Bargain extra-long wicks with spool. Makes it easy to take anywhere. Instructions for use: 1.In desoldering, after the chips are taken down, the mainboard will leave a lot of solder, which will affect the chip welding. Usually cleaning the tin, the method is to put the iron tip on the suction tin wick, and then slowly move on the chip pads, and the solder will be sucked up with the suction tin wick. 2.After this, the best method is to clean the chips with washer water. Tin of big chip components can be cleaned with the suction tin wick. Tin of aluminum electrolytic capacitors can be cleaned with suction tin. 3.After each use, cut off the part of used, you can reuse. Specification: CP-15B; 1.5mm*30M CP-20B; 2.0mm*30M CP-25B; 2.5mm*20M CP-30B; 3.0mm*20M CP-35B; 3.5mm*15M