Mesin Service Mesin Reball BGA Laptop, PS2, PS3, PS4, Xbox dll

Garansi Service dan sparepart 1 tahun. Guna mengangkat/mengganti ic Chipset VGA Laptop/Notebook, RSX CPU PS2 PS3 Chipset XBOX dll. Lebih aman dari gosongnya ic gembungnya PCB. Garansi resmi 1 tahun. Barang 100% baru, Oribinal siap pakai. Wajib menggunakan Pos Indonesia, karena ada asuransinya utk barang rusak, pecah, patah dsb, kecuali anda setuju untuk tidak Komplain dan menggunakan kurir swasta.. Dengan melakukan checkout berarti anda setuju dengan peraturan kami yaitu no komplain no retur. Product Features: (1) Use of infrared welding technology which is developed independently. (2) Use of an infrared heat lamp. Heat is easy to pierce and distribute evenly. which overcomes disadvantage (burn out elements) of traditional welding machines. (3) Easy operation. You just need one-day training and you can operate it skillfully. (4) No need for unsolder tools. This machine can unsolder all computers between 5-50mm. ( Remember use Insulation tape around small chips under 40mm) (5) This machine has 800W hot-melt system. Its preheating area is 240180mm (6) Infrared heating without heated air flowing. No impact on circumjacent small elements. It is suitable for all of the elements,especially Micro BGA components. (7) This is suitable for a variety of computers, notebooks and the rework or repair computer architecture. Technical Parameters: Work floor size 360X240mm Rated voltage and frequency AC220-230v 60/50Hz Complete machine power 1000W Infra-red lamp body power 150W Preheating chassis power 800W Infra-red lamp body heating size 70mm(5050mm) Preheating chassis preheating size 240180mm Infra-red lamp body temperature range 200 -350 Preheating chassis temperature range 60 -200