Bus: 8 bit (HS SDR 52MHz) Access mode: sector mode Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V) Card/BGA: BGA (Discrete embedded) - High density MMC Manufacturer ID: 0x15 (Samsung) Product name: QE13MB (0x514531334d42), rev: 0x0D, serial number: 0xD45DCEE6 Manufacturing date: Oct 2016 CID: 15010051 4531334D 420DD45D CEE6A394 CSD: D0270132 0F5903FF F6DBFFEF 8E40400C EXT_CSD revision: 1.8 (MMC ) Capacity: 14.57 GiB(15,646,851,072 bytes) Partition info: Boot1: 4096 KiB Boot2: 4096 KiB RPMB: 4096 KiB User area: 14.56 GiB(15,634,268,160 bytes) Cache size: 64 MiB Partition configuration: 0x00 No boot acknowledge is sent (default) Device is not boot-enabled (default) Partitioning support: 0x07 Device support partitioning feature Device can have enhanced technological features Device partitioning possible Boot configuration protection: 0x00 Boot bus conditions: 0x00 Boot area write protection: 0x00 Power-on write protection: possible Permanent write protection: possible Lock status: not locked User area write protection: 0x50 Password protection features: enabled Power-on write protection: possible Permanent write protection: not possible Lock status: not locked
Mfr Package Description BGA-221 Status Active Microprocessor/Microcontroller/Peripheral IC Type SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
Data Transfer Rate-Max 200.0 MBps JESD-30 Code X-PBGA-B221 Number of Terminals 221 Package Body Material PLASTIC/EPOXY Package Code BGA Package Shape UNSPECIFIED Package Style GRID ARRAY Surface Mount YES Technology CMOS garansi check by external host (emmc tool box) as always.