Mijing Z21Max Universal Cpu Reballing Stencil Platform For

Mijing Z21Max Universal Cpu Reballing Stencil Platform For
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Iscustomized : No
Package : Case
Model Number : Mijing Z21 Max Chip Tin Station
Application : Mobile Phone Repair
Type : Combination
Diy Supplies : Electrical
Brand Name : Phonefix
Origin : Mainland
Certification : Ce
Item Name : Mobile Phone Cpu Reballing Stencil Platform
Function : For Iphone 6-X Xs Xsmax Cpu Repair,Cpu Ic Tin Planting
Support 1 : For Iphone 11 12 12 Pro 13 Mini 13 Pro Max
Support 2 : For Iphone 14/14 Plus/14Pro/14 Pro Max
Support 3 : For /Hisilicon /Qualcomm /Snapdragon/ Kirin /Emmc/Emcp
Features : Double Magnet, Super Magnetic, Accurate Positioning
Usage : Motherboard Reballing Soldering Platform


Mj Z21 Max Chip Tin Station Cpu Reballing Platform With A8-A16 Steel Mesh Precise Positioning For Iphone 6-14 Pro Max Android



Mijing Z21 Max Chip Tin Station Cpu Reballing Stencil Platform For Iphone 6-14 Pro Max A8-A16 Cpu, Android Phones. Mj Z21 Max Cpu Ic Tin Planting Platform With Stell Mesh For Iphone Android Cpu Repair. Mijing Z21 Max Cpu Reballing Stencil Platform For Iphone A8 A9 A10 A11 A12 A13 A14 A15 A16 Cpu, Android Qualcomm,Ect.

Applicable Model:

1. For Iphone 6-14 Pro Max Cpu (A8 A9 A10 A11 A12 A13 A14 A15 A16 Cpu).

2. For Hi3670, Hi3680, Hisilicon Hi3690, Hisilicon Hi3690 5G, Hisilicon Hi6290/L, Qualcomm Sm8250-102 Small, Qualcomm Sm8250-202 Large, Qualcomm Sm8350/Snapdragon 888, Snapdragon 845/Sdm845, Snapdragon 855/Sm8150, Kirin 9000 Hi36A0, Emmc/Emcp/Ufs Bga153.

Option:

1. Z21 Max For Iphone.

2. Z21 Max For
TOOLS180292