BGA SMD IRDA Welder Heating Rework Station Preheater Soldering Desoldering Station T-8120+T-835 Infrared Rework Station

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Model Number : T-8120+T-835
Origin : Mainland China
Certification : CE
DIY Supplies : ELECTRICAL


1.Products Features:

1. The machine selects the infrared highly effective component to give off heat which independent exploration, adopt advanced PID intelligent controlling warm heating technology, controls warm precisely.

2. Can achieve to heat PCB board and component which contains lead or not,especially suit to BGASMD.

3. Use infrared heat, easy to cut through, heat proportion, don't have sirocco flow. Don't shift the small component on the PCB board,ensure the welding quality.

4. This machine has 600W heating system, widely to 120x120mm.Can use with the handhold infrared welder T-835.

5. Easily operate, can operate it through easy training.

Main Parameter of T-8120:

Work floor size

200x240mm

Rated voltage and frequency

AC220-230v/AC110V 60/50Hz

Complete machine power

800W

Preheating chassis power

600W

Preheating chassis size

120x120mm

Preheating chassis temperature adjustable

0-450

3.Main Component:

Preheating oven main body

1

Temperature sensor

1

Board support of the circuit

1

Power line

1

User manual (compact disc)

1

Technical parameter of T-835:

Rated voltage and frequency

AC220v/AC110v/50-60Hz

Complete machine power

300W

Infra-red lamp power

100W

Infra-red lamp heating size

35mm

Adjustable temperature of Infra-red lamp

0-350

5. Main Parts:

Name

Model

Quantity

Welding table

T-835

1

Infra-red lamp

1

Temperature sensor

K-degree

1

Infra-red lamp holder

1

Power cable

0.75x1.8m

1

user manual(Compact disc))

1

6. Operation method:

6.1.Starting and inspections before starting:

. Check if the cables of infra-red lamp, temperature sensor and power supply were connected well or not before starting.

. Turn on the power supply switch. Then let the machine work till Self-checking is finished. (Temperature displayed after self-checking is your room temperature.)

. Switches on the front panel are used to control the work process of infrared lamp. Press the front panel "" up button, "" down button to adjust the temperature of infrared lamp between 0-350. Press the switch "ON" to let infrared lamp work; press the switch "OFF" to stop working.

6.2. Sealing off/repair operation:

6.2.1 PCB board laying aside:

Will elect well the PCB board select the appropriate working position.

6.2.2 Before sealing off/repair adjustment and preparatory work:

.According to the chip size and the welding technological requirement, selects the suitable infrared lamp the heating temperature(0-350 adjustable). When the sealing off is smaller than the 15x15mm chip, may adjust the infra-red lamp temperature to 160-240 about; When the sealing off/repair is smaller than the 20x20mm chip, may adjust the infra-red lamp temperature to 220-240 about; Opens in a big way, when 30x30mm chip, according to the craft and the user experience, may adjust the infra-red lamp 240-260; about.

Adopt infrared heat lamps no steps, you can adjust the size according to chip temperature freely. When the infrared heat lamps adjustment knob to adjust the largest, most powerful infrared light line, warming up faster chip, in the process of welding special attention to temperature control, to prevent displacement temperature senor chips not lead to heat a long time, heating up too high, burned chips.

.Regulation infrared temperature senor lights, place it in the chips or aside suitable location nearby. Chip in and around the senor head painted Flux(welding or welding-oil),this would enable senor measured the temperature more accurately, while helping the solder flux role, BGA pad will be more intact, can effectively prevent the pads from the stick and tin from the hair, and other issues.

6.3. Soldering / unsoldering operation:

6.3.1. Fix the PCB board: Put the PCB board to suitable place.

6.3.2. Preparation and adjustment before soldering/unsoldering:

Adjust infra-red lamp input temperature between 0-350 according to Chip's size and requirements of welding technology. Set temperature between 160-240 to unsolder chips which size is under 15x15mm size; between 220-240 to unsolder chips under 20x20mm; adjust the temperature between 240-260 to unsolder chips over 30x30mm.

This machine adopts stepless methods to regulate temperature. When you regulate infra-red lamp to max power, infra-red lamp releases the strongest rays to make chip's temperature rise fastest. In the process of welding, please pay attentions to temperature control sensor to avoid burning chips because of high temperature.

Put the temperature sensor at the suitable place near the Chip. Spread flux on the head of sensor for accurate temperature; spread flux around the chip to guarantee better welding.

6.3.3 Unsoldering/ soldering process:

6.3.3.1. Unsoldering process:

. Fix PCB board.

. Place the temperature