Features • Dynamic Efficiency Line with BAM (Batch Acquisition Mode) – 1.7 V to 3.6 V power supply – - 40°C to 85/105/125 °C temperature range • Core: Arm 32-bit Cortex-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 512 Kbytes of Flash memory – 128 Kbytes of SRAM • Clock, reset and supply management – 1.7 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Power consumption – Run: 100 µA/MHz (peripheral off) – Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ @ 25C; 65 µA max @25 °C – Stop (Flash in Deep power down mode, slow wakeup time): down to 9 µA @ 25 °C; 28 µA max @25 °C – Standby: 1.8 µA @25 °C / 1.7 V without RTC; 11 µA @85 °C @1.7 V – VBAT supply for RTC: 1 µA @25 °C • 1×12-bit, 2.4 MSPS A/D converter: up to 16 channels • General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support • Up to 11 timers: up to six 16-bit, two 32-bit timers up to 100 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer
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