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Rp211.000

BGA Reballing Stencil For Samsung A33 A53 A536 A13 A21S F13 M33 Exynos1280 E8825 Exynos850 3830 CPU RAM EMMC DDR RF Power IC

Rp211.000
  • Kondisi: Baru
  • Min. Pemesanan: 1 Buah
  • Etalase: Semua Etalase
Welcome to our store
We specialize in integrated circuit chips
If you need to purchase more models
Click on the“Add To Cart”
• Shipping Information
Items will be ship within3 daysof payment receive.
working days(2-4 weeks)to receive for most area.
If you do not receive item within 30 working days(5 weeks), please contact us to investigate the case.
The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.
As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning
careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1) Have you bought the right chips?
2) Do you have proper equipment?
3) Are you skillful enough to solder the chips?
Specifications:
Origin: Mainland China
Model Number: SAM16
Certification: None

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