5.0/ 5.0
100% pembeli merasa puas
3 rating • 1 ulasan
5(3)100%
4(0)0%
3(0)0%
2(0)0%
1(0)0%
Atur jumlah dan catatan
Stok Total: 39
harga sebelum diskonRp1.000.000
Subtotal
Rp970.000
WEP 946A (II) LCD Display Touch Screen Glass Separator Repair Machine
Rp970.000
diskon 3%
Harga sebelum diskon Rp1.000.000
- Kondisi: Baru
- Min. Pemesanan: 1 Buah
- Etalase: Semua Brand WEP
Specifications
1.CPU temperature control
2.Mobile phone integration screen split
To saperate the moble phone, suitable TEMP is under 100 ℃
In winter, suitable TEMP is 90℃
In summer,suitable TEMP is 70-80℃
Packaging information:
Inner box size:38*21*17 cm
Goods weight :3.8kg/pcs
Outer carton size:50.5*29*43.5 cm
Application Scope
1) Electronic product assembly for industrial production
2) Product development for scientific research departments
3) Repair industry for electronic product inspection and maintenance
4) Soldering operations for electricians in various enterprises and institutions
5) Electronic assembly for electronic technology enthusiasts
6) Student skills training for a variety of electrical colleges
7) Suitable for a variety of component desoldering and soldering, such as: SOIC,
CHIP, QFP, PLCC, BGA, SMD, etc.
8) Suitable for heat shrinking, drying, painting, adhesive removal, thawing, preheating,
plastic welding, etc.
1.CPU temperature control
2.Mobile phone integration screen split
To saperate the moble phone, suitable TEMP is under 100 ℃
In winter, suitable TEMP is 90℃
In summer,suitable TEMP is 70-80℃
Packaging information:
Inner box size:38*21*17 cm
Goods weight :3.8kg/pcs
Outer carton size:50.5*29*43.5 cm
Application Scope
1) Electronic product assembly for industrial production
2) Product development for scientific research departments
3) Repair industry for electronic product inspection and maintenance
4) Soldering operations for electricians in various enterprises and institutions
5) Electronic assembly for electronic technology enthusiasts
6) Student skills training for a variety of electrical colleges
7) Suitable for a variety of component desoldering and soldering, such as: SOIC,
CHIP, QFP, PLCC, BGA, SMD, etc.
8) Suitable for heat shrinking, drying, painting, adhesive removal, thawing, preheating,
plastic welding, etc.
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