Thermal Grease Paste Compound Silicon CPU / GPU HeatSink

"HY500 series thermal grease , bettercooling performance with high thermal coductivity graphite and powder.This thermal grease should be used to fill the gaps and expand cooling area between heating unit and the heat sink ROHS&PFOS&REACH application with SGS testing report.Many types of packing with differrent weight to fullfill your diversified requiments.





Parameter



color :grey



Weight(N.W) : 3g (as the picture)



Thermal conductivity> 1.93 W/m-k



Thermal Impedance 0.225Specific Gravity 2.0



Viscosity1000



Thixotropic Index : 380+_10



Viscosity : -50~300



Operation Temoreture : -30~300



Silicone Compounds : 50r/>Carbon Compounds : 30r/>Metal Oxide Compounds : 20r/>



Specification:





Graphite Thermal Grease,



thermal Conductivity 1.93W/m-k~2.15W/m-k



Good Electric Insulating,



Breakdown 10Kv voltageLow Temrmal Impendance,



Keep grease condition with long timeWith a wide range working tempreture,



keep stable performance at tempreture -30~300High performance ,



saving your cost





Application:





High Thermal Demand MoudleCooling device to the end plate or between the frameHigh speed and large storage DriveAutomotive Engine controlHard disk drive and DVD drivePower conversion apparatusHigh Power LEDNotebook and desktop computersNetwork Communicaion EquipmentHousehold appliances, electronic components, electrical."