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Rp197.382
Amao SAM15 SM8350 Exynos2100 CPU MAX77705C SDR868 KM049 78105 BGA Reballing Stencil for Samsung S21/21+/21 Ultra G998U/G996U/Z
Rp197.382
- Kondisi: Baru
- Min. Pemesanan: 1 Buah
- Etalase: Semua Etalase
1005007554801828
Selamat Datang Di Toko Kami
Semua Barang PreOrder 15-30 Hari
Selamat Belanja
Model Number : SM8350 Exynos2100 CPU MAX77705C SDR868 KM049 78105
Origin : Mainland China
Type : Module
Application : MOBILE PHONE
Condition : New
Package : SMD
Hign-concerned Chemical : None
Amao SAM15 SM8350 Exynos2100 CPU MAX77705C SDR868 KM049 78105 BGA Reballing Stencil for Samsung S21/21+/21 Ultra G998U/G996U/Z
Dear friends
If you purchase more, please contact us for discounts.
Please pay attention to the following instruction upon receipt our chips
The BGA chips you buy from our company are of high technology and as precise as nanometer.
For small quantity of chips, they are exposed to the air after being taken out from package. 5o they probably will adhere to some humidity. Thusin order to avoid quality problem, we suggest that you put them inside a baking chamber for at least 24 hours at 100-110".
When soldering,please BGA Reballing (proposal replace medium or low temperature solder paste)
The soldering process is complicated. soldering/replacing chips must be operated by engineers who have proficient skills
AS BGA chips are fragile, complicatedly structured, with numerous balls, any slightly faulty positioning, careless temperature-control,or
incomplete cleaning PcB boards will result in insufficient soldering or missing soldering. The chips will, as a result, die.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1)Have you bought the right chips?
2)Do you have proper equipment?
3) Are you skillful enough to solder the chips?
Our advantage
our company has been specialized in BGA chips for over 10years.
We are very familiar with the performance ofthe chip. the quality of the chip is very strict control, To ensure that every chip sent out is very goodquality.
we welcome everyone who is experienced in BGA chips to buy in our store again.
for those who are not familiar with BGA chips,we would decline with thanks.
Shipment We can ship the products all the world.Free shipping by post air mail. DHL,UPS, EMS, standared shipping are all available.
3.. The item will be sent out with 3days after receiving the payment.
4. Please make sure your delivery address and contact telephone number are correct when you make a order. You can track the situation of your product website after they are shipped out.
Warranty
1. lf the item is defective upon receipt,it should be within 7days from the date of receipt for exchange a new one (Buyer should return alloriginal and undamaged items under re-saleable condition).,returns if parts that have been used the machines willnot be acceptable.2.- Once we get the returned items, we will send the replaced ones back as soon as possible.3. Our warranty does not extend to any products that are physicaly damaged or under un-normal operating conditions as a result of misuse orimproper installation the parts.
Selamat Datang Di Toko Kami
Semua Barang PreOrder 15-30 Hari
Selamat Belanja
Model Number : SM8350 Exynos2100 CPU MAX77705C SDR868 KM049 78105
Origin : Mainland China
Type : Module
Application : MOBILE PHONE
Condition : New
Package : SMD
Hign-concerned Chemical : None
Amao SAM15 SM8350 Exynos2100 CPU MAX77705C SDR868 KM049 78105 BGA Reballing Stencil for Samsung S21/21+/21 Ultra G998U/G996U/Z
Dear friends
If you purchase more, please contact us for discounts.
Please pay attention to the following instruction upon receipt our chips
The BGA chips you buy from our company are of high technology and as precise as nanometer.
For small quantity of chips, they are exposed to the air after being taken out from package. 5o they probably will adhere to some humidity. Thusin order to avoid quality problem, we suggest that you put them inside a baking chamber for at least 24 hours at 100-110".
When soldering,please BGA Reballing (proposal replace medium or low temperature solder paste)
The soldering process is complicated. soldering/replacing chips must be operated by engineers who have proficient skills
AS BGA chips are fragile, complicatedly structured, with numerous balls, any slightly faulty positioning, careless temperature-control,or
incomplete cleaning PcB boards will result in insufficient soldering or missing soldering. The chips will, as a result, die.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1)Have you bought the right chips?
2)Do you have proper equipment?
3) Are you skillful enough to solder the chips?
Our advantage
our company has been specialized in BGA chips for over 10years.
We are very familiar with the performance ofthe chip. the quality of the chip is very strict control, To ensure that every chip sent out is very goodquality.
we welcome everyone who is experienced in BGA chips to buy in our store again.
for those who are not familiar with BGA chips,we would decline with thanks.
Shipment We can ship the products all the world.Free shipping by post air mail. DHL,UPS, EMS, standared shipping are all available.
3.. The item will be sent out with 3days after receiving the payment.
4. Please make sure your delivery address and contact telephone number are correct when you make a order. You can track the situation of your product website after they are shipped out.
Warranty
1. lf the item is defective upon receipt,it should be within 7days from the date of receipt for exchange a new one (Buyer should return alloriginal and undamaged items under re-saleable condition).,returns if parts that have been used the machines willnot be acceptable.2.- Once we get the returned items, we will send the replaced ones back as soon as possible.3. Our warranty does not extend to any products that are physicaly damaged or under un-normal operating conditions as a result of misuse orimproper installation the parts.
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