RAK3172 Breakout Board

RAK3272S Breakout Board dirancang khusus untuk memungkinkan akses mudah ke pin di papan untuk menyederhanakan pengembangan dan pengujian. Jejak papan breakout didasarkan pada faktor bentuk XBee dan tujuan utamanya adalah memungkinkan pin modul stempel RAK3172 ditransfer ke header 2,54 mm. Firmwarenya didasarkan pada RAKwireless Unified Interface V3 (RUI3) yang memungkinkan Anda membuat berbagai fungsi menggunakan RUI API. Papan itu sendiri memiliki RAK3172 pada intinya, mengintegrasikan chip STM32WLE5CC, Memiliki Konsumsi Daya Ultra Rendah 1,69uA dalam mode tidur Modul ini sesuai dengan spesifikasi Kelas A, B amp; C LoRaWAN 1.0.3. Ini juga mendukung mode komunikasi LoRa Point to Point (P2P) yang membantu Anda dalam mengimplementasikan jaringan LoRa jarak jauh khusus Anda dengan cepat. Fitur Produk : AS923 Berdasarkan RAK3172 Port I/O: UART/I2C/GPIO/SPI Antarmuka Serial Wire Debug (SWD). Ukuran modul: 25,4 x 32,3 mm Tegangan Pasokan: 2,0 V ~ 3,6 V Kisaran Suhu: -40° C ~ 85° C ===== RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers. Its firmware is based on RAKwireless Unified Interface V3 (RUI3) that allows you create different functionalities using RUI APIs. The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip, It has Ultra-Low Power Consumption of 1.69uA in sleep mode This module complies with Class A, B amp; C of LoRaWAN 1.0.3 specifications. It also supports LoRa Point to Point (P2P) communication mode which helps you in implementing your own customized long-range LoRa network quickly. Product Features : AS923 Based on RAK3172 I/O ports: UART/I2C/GPIO/SPI Serial Wire Debug (SWD) interface Module size: 25.4 x 32.3 mm Supply Voltage: 2.0 V ~ 3.6 V Temperature Range: -40° C ~ 85° C =====