Ly 5300 Auto Optical Alignment System Bga Rework Station 2 Zones

Selamat Datang di Toko Kami. - Kami Menjual Produk-produk Import - Produk Dikirim dari Luar Negeri. - Estimasi Kiriman 5-15 Hari. Mohon Menunggu is_customized : Yes Model Number : LY 5300 Certification : CE Power supply : AC 220V10% 50/60Hz Total power : Max 2500W PCB size : Max 140X160mm Min 5X5 mm Applicable chips : Max 80X80mm Min 1X1 mm LY 5300 Auto Optical Alignment System BGA Rework Station 2 Zones 2500W Soldering Welding Machine for Repairing Mobile Phone Mobile rework video: Our BGA Rework Station/ BGA reballing stationare widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc. How to separate BGA chip from motherboard? How to replace a new BGA chip? Repair steps: 1) Separate the BGA chip from mother board we called desoldering 2) Clean Pad 3) Reballing or replace a new BGA chip directly 4) Alignment/Positioning Depend on experience ,silk frame ,optical camera 5) replace a new BGA chip - we called Soldering Power supply AC 220V10% 50/60Hz 3 Total power Max 2500W 4 Heater power Upper 1200W,Down 1200W 5 Electrical material Driving motor+ smart+color touch screen 6 Temperature controlling (high precision K-sensor)(Closed Loop),independent,the precision can reach 1 7 Locating way Vshape slot,PCBsupport jigs can adjust 8 PCB size Max140160mm Min55mm 9 Applicable chips Max 8080mm Min11mm 10 Overall dimension L450WG0H670mm 11 Temperature Interface 1 12 Weight of machine 40KG 13 Color Blue+White Mini BGA rework station Nozzles : 3 top,1 bottom(Top 18*18mm,12*12mm,14*20mm,Bottom 25*25mm)