RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Tinned BGA Reballing Kits For Qualcomm Snapdragon

RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Tinned BGA Reballing Kits For Qualcomm Snapdragon
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With Magnetic : No
Model Number : Relife RL-044
Pieces Included : 6 in 1
Material : S2 Alloy Steel
Origin : Mainland China
Name : Android Serues Chip Tinned Steel Stencil Set
Quantity : 35PCS/Box
Thickness : 0.12/0.15mm(EMMC series)
Configuration : ACU*4/ EMMC*6 /HIC*9/ MTC*6/SMC*10


RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Tinned BGA Reballing Kits For Qualcomm Snapdragon

Feature
1.The real machine is measured to ensure accuracy, and each stencil is checked according to the original factory drawings to ensure that every solder joint cannot be missing

2.It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips.

3.Ultra-thin design, better fit of tin planting, continuous bending and full toughness
4 1BOX contain 3pcs

For Wholesale
If you need more products or you are a wholesaler, please contact me directly for quotation list and information about shipping charge.
: 18676368595.

Pictures For Reference:

Note
1. We have all parts for mobile phone repair, OCA film/Polarizer film/Front Glass/Touch Screen/Any kinds of Adhesive stickers/Backlight/Frame/Back cover/Flex cable/Software etc. is one parts of we supply, we also have technical training service and LCD repair equipment / mould supply. If you are interested, please feel free to contact me.
2. We use official shipping method, which guarantees timeliness, security and service. if you need faster delivery, please contact us or choose express by yourself, thank