Atur jumlah dan catatan
Stok Total: 1000
Subtotal
Rp1.710.900
RELIFE RL-044 58PCS BGA Reballing Stencil Set for Qualcomm |Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
Rp1.710.900
- Kondisi: Baru
- Min. Pemesanan: 1 Buah
- Etalase: Semua Etalase
SELAMAT DATANG DI TOKO KAMI, SILAHKAN DIORDER KAK
HAPPY SHOPING
Brand Name : SUNSHINE
Model Number : RELIFE RL-044 58PCS/Set BGA Reballing Stencil Set
Size : As Description
Type : Combination
Application : Computer Tool Kit
Origin : Mainland China
Package : Case
is_customized : No
DIY Supplies : Metalworking
Hign-concerned Chemical : None
Feature : High temperature resistance/Precise alignment
RELIFE RL-044 58PCS/Set BGA Reballing Stencil Set for Qualcomm Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
HAPPY SHOPING
Brand Name : SUNSHINE
Model Number : RELIFE RL-044 58PCS/Set BGA Reballing Stencil Set
Size : As Description
Type : Combination
Application : Computer Tool Kit
Origin : Mainland China
Package : Case
is_customized : No
DIY Supplies : Metalworking
Hign-concerned Chemical : None
Feature : High temperature resistance/Precise alignment
RELIFE RL-044 58PCS/Set BGA Reballing Stencil Set for Qualcomm Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
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