GD900 4.8 W/m-K Thermal Paste - Setengah Gram

GD900 thermal paste selects much more tiny particle diameter metal oxide as the main raw materials, used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU/GPU/LED will meet your high standard demand for cooling system. Working principle: Filling the gap between heating elements and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect. Method of use: It #39;s normal phenomena if there is little silicone oil floating above. Please stir well before use. Keep the coated surface clean and apply directly with tools (such as scraper, finger cot, etc). Warm notice: Keep children away from it. If it is swallowed or inadvertently come into eyes, ear, nose, mouth, please flush with clean water or send to hospital when necessary. Storage: Preservation at normal temperature. Please cover it after used, avoiding impurities such as dust, that have a bad effect on thermal conductivity. Smearing Steps 1. Please clean the surfaces of heat source (CPU) and dissipate heat device (heat sink) with dry tissues. 2. Using scraper or other tools to smear the thermal paste onto the CPU, and it #39;s no need to smear on heat sink. 3. The thermal paste should be smeared evenly on the whole CPU surface. It can neither too thin (the printed words on it should be covered) nor too thick (the thickness like A4 paper will be better). Product features: Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive. Color: Gray Specific Gravity: 2.3 g/cm3 Thermal Conductivity: 4.8 W/m-K Operating Temperature: -50 - 200oC Material: Silicone paste Net weight: 1g, 3g Package Contents:  1x GD900 Thermal Paste (loose pack) Only the above package content, other products are not included.