Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Specific Gravity : 2.37
Viscosity/Flowability Nonflowing
Thermal Conductivity : : 0.8 watts/meter- °C
Volume Resistivity : 5.0 x 1015
Dielectric Constant : 4.4 at 100k Hz
Dissipation Factor : 0.02 at 100k Hz
Dielectric Strength : 550 volts/mil; 21.7 kV/mm
-Suitable for CPU, chipsets on Mainboard, VGA card, etc.
-Easy to use.
-Zif Socket Templates ensure correct applying area with various CPU socket types.