GIGABYTE B760M AORUS ELITE AX DDR5 INTEL B760 LGA1700 MOTHERBOARD

HARAP TANYAKAN STOK TERLEBIH DAHULU SEBELUM DIORDER REGARDS, HRW SOLUTION Intel Socket LGA 1700：Support 13th and 12th Gen Series Processors Unparalleled Performance：Twin 12*+1+1 Phases Digital VRM Solution Dual Channel DDR5：4*SMD DIMMs with XMP 3.0 Memory Module Support Next Generation Storage：2*PCIe 4.0 x4 M.2 Connectors Advanced Thermal Design amp; M.2 Thermal Guard ：To Ensure VRM Power Stability amp; M.2 SSD Performance EZ-Latch Plus：M.2 Connectors with Quick Release amp; Screwless Design Fast Networks： 2.5GbE LAN amp; Intel Wi-Fi 6E 802.11ax Extended Connectivity：Front USB-C 10Gb/s, Rear USB-C 20Gb/s, DP, HDMI Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card * 6+6 phases parallel power design CPU LGA1700 socket: Support for the 13th and 12th Generation Intel Core, Pentium Gold and Celeron Processors* L3 cache varies with CPU Chipset Intel B760 Express Chipset Memory Support for DDR 0(O.C.) / 7400(O.C.) / 7200(O.C.) / 7000(O.C.) / 6800(O.C.) / 6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules Storage Interface CPU: 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) Chipset: 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB) 4 x SATA 6Gb/s connectors RAID 0, RAID 1, RAID 5, and RAID 10 SKU : 3131/1520677295452798976/55