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BREAK-THROUGH IN HEAT TRANSFER The MasterAir G100M Heat column technology is a two-phase heat transfer involves the liquid-vapor phase change (boiling/evaporation and condensation) of a working fluid. The fluid is transferred by the copper powder filled inside the column creating an anti-gravity heat transfer.
7X LARGER DIAMETER THAN HEATPIPES Super quick heat transfer is made possible with Heat Column at a massive Ø41.2, the equivalent of 7X the size of traditional heatpipes. The unification of heatpipes and base into one unit captures and efficiently transfers the heat from CPU like never seen before.
LOW PROFILE FOR MINI-ITX BUILDS The low profile G100M stands at 74.5mm, a great fit for slim PC cases, including mini-ITX cases. Even at these small dimensions, the heatsink has cooling capacity of 130W TDP.
Specifications Product Name MasterAir G100M Model number MAM-G1CN-924PC-R1 CPU Socket Intel LGA 2066 / 2011-3 / 2011 / 1151 / 1150 / 1155 / 1156 / 1366 / 775 socket
AMD AM4 / AM3+ / AM3 / AM2+ /AM2 / FM2+ / FM2 / FM1 socket Dimensions 145 x 145 x 74.5 mm (5.7 x 5.7 x 2.9 inch) Heat Sink Dimensions 143 x 143 x 51.7 mm (5.6 x 5.6 x 2.0 inch) Heat Sink Material Heat Column / Aluminum Fins Heat Sink Weight 320g (0.70lb.) Heat Column Dimensions Ø41.2*46.3 mm Fan Dimensions 92 x 92 x 25 mm (3.6 x 3.6 x 1 inch) Fan Speed 600~2400 RPM (PWM) ± 10% Fan Airflow 22.63 CFM ± 10% Fan Air Pressure 1.6 mmH2O ± 10% Fan MTTF 280,000 hrs LED color RGB ready Fan Noise Level (dBA) 30 dBA (Max) Fan Connector 4-Pin (PWM) Fan Rated Voltage 12 VDC Fan Rated Current 0.34 A Fan Safety Current 0.37 A Fan Power Consumption 4.08 W Warranty 2 years EAN Code 4719512065341 UPC Code 884102037863
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