Processor Technology for CPU Cores TSMC 5nm FinFET Processor Technology for I/O Die TSMC 6nm FinFET CPU Compute Die (CCD) Size 71mm² I/O Die (IOD) Size 122mm² Package Die Count 3 Unlocked for Overclocking Yes AMD EXPO Memory Overclocking Technology Yes Precision Boost Overdrive Yes Curve Optimizer Voltage Offsets Yes AMD Ryzen Master Support Yes CPU Socket AM5 Supporting Chipsets X670E X670 B650E B650 CPU Boost Technology Precision Boost 2 Instruction Set x86-64 Supported Extensions AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 Thermal Solution (PIB) Not included Max. Operating Temperature (Tjmax) 95°C Launch Date 9/27/2022 *OS Support Windows 11 - 64-Bit Edition Windows 10 - 64-Bit Edition RHEL x86 64-Bit Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.
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