4.0/ 5.0
50% pembeli merasa puas
2 rating • 1 ulasan
5(1)50%
4(0)0%
3(1)50%
2(0)0%
1(0)0%
Atur jumlah dan catatan
Stok Total: 17
Subtotal
Rp200.000
HyperX FURY Memory Black - 8GB Module - DDR4 2666MT/s CL16 DIMM - 2ND
Rp200.000
- Kondisi: Bekas
- Min. Pemesanan: 1 Buah
- Etalase: MEMORY RAM PC DDR4
SECOND
NORMAL SIAP PAKAI
GARANSI TOKO 3 HARI
SPECIFICATIONS
*Power will vary depending on the SDRAM used.
HX426C16FB2/8
8GB 1G x 64-Bit
DDR4-2666 CL16 288-Pin DIMM
Continued >>
kingston.com/hyperx
FEATURES
HyperX HX426C16FB2/8 is a 1G x 64-bit (8GB) DDR4-2666 CL16
SDRAM (Synchronous DRAM) 1Rx8, memory module, based on
eight 1G x 8-bit FBGA components per module. Each module
supports Intel Extreme Memory Profiles (Intel XMP) 2.0.
Each module has been tested to run at DDR4-2666 at a low latency
timing of 16-18-18 at 1.2V. Additional timing parameters are
shown in the Plug-N-Play (PnP) Timing Parameters section
below. The JEDEC standard electrical and mechanical
specifications are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
16 cycles
45.75ns(min.)
350ns(min.)
29.25ns(min.)
TBD W*
94 V - 0
0o
C to +85o
C
-55o
C to +100o
C
JEDEC/XMP TIMING PARAMETERS
• JEDEC/PnP: DDR4-2666 CL16-18-18 @1.2V
• XMP Profile #1: DDR4-2666 CL16-18-18 @1.2V
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP = 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink
NORMAL SIAP PAKAI
GARANSI TOKO 3 HARI
SPECIFICATIONS
*Power will vary depending on the SDRAM used.
HX426C16FB2/8
8GB 1G x 64-Bit
DDR4-2666 CL16 288-Pin DIMM
Continued >>
kingston.com/hyperx
FEATURES
HyperX HX426C16FB2/8 is a 1G x 64-bit (8GB) DDR4-2666 CL16
SDRAM (Synchronous DRAM) 1Rx8, memory module, based on
eight 1G x 8-bit FBGA components per module. Each module
supports Intel Extreme Memory Profiles (Intel XMP) 2.0.
Each module has been tested to run at DDR4-2666 at a low latency
timing of 16-18-18 at 1.2V. Additional timing parameters are
shown in the Plug-N-Play (PnP) Timing Parameters section
below. The JEDEC standard electrical and mechanical
specifications are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
16 cycles
45.75ns(min.)
350ns(min.)
29.25ns(min.)
TBD W*
94 V - 0
0o
C to +85o
C
-55o
C to +100o
C
JEDEC/XMP TIMING PARAMETERS
• JEDEC/PnP: DDR4-2666 CL16-18-18 @1.2V
• XMP Profile #1: DDR4-2666 CL16-18-18 @1.2V
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP = 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/heatsink
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