Thermal Pasta Coolermaster

READY STOK Specifications Color White Specific Gravity 2.37 Viscosity/Flowability Nonflowing Shelf Life 24 months from DOM Thermal Conductivity 0.8 watts/meter-C Volume Resistivity 5.0 x 1015 Dielectric Constant 4.4 at 100k Hz Dissipation Factor 0.02 at 100k Hz Dielectric Strength 550 volts/mil; 21.7 kV/mm Features: - Suitable for CPU, chipsets on Motherboard, VGA cards, etc - Easy to use - Zif Socket Templates ensure correct applying area with various CPU socket types - Produces an even layer when using applicator - Dielectric - Wide range of application temperature Overview Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177 degrees Celsius, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.