Lanthanum Manganate (LaMnO3) Sputtering Targets

7.04.05.Lanthanum Manganate Sputtering Targets Lanthanum Manganate (LaMnO3) Sputtering Targets, Purity: 99.9%, Size: 8 #39; #39;, Thickness: 0.250 #39; #39; Applications of Sputtering Targets; Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering that involves eroding material from a #34;target #34; source onto a #34;substrate #34; such as a silicon wafer. Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern. Sputter targets is also used for analysis by etching away the target material.